WaferForge™

Deterministic Yield Gating for Glass Core Substrates

Stop the “Walking Wounded.”

Protect every $15,000 module before chiplet attach.

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Deterministic Yield Gating for
Glass Core Substrates

Powered by the Harden Criticality Index (HCI)

Stop the “Walking Wounded.” Protect every $15,000 module before chiplet attach.

As the industry transitions to 510 mm Glass Core Substrates for 1.6T Co Packaged Optics, traditional AOI is failing to detect subsurface stress states that lead to catastrophic fractures during RDL build up, anneal, or reflow.

The Harden Criticality Index (HCI) is a physics based, standards aligned reliability gate that predicts fracture before high value assembly.

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The Problem: The Walking Wounded

Large format glass panels store hidden elastic energy from TGV formation and RDL thermal cycles. AOI cannot see this. HCI quantifies the Energy Release Rate (G) and predicts failure before it happens.

The HCI Engine

HCI computes:
• σnet — volumetric + thermal stress
• RGE — Radial Geometric Effect
• Λeffective — warpage adjusted clamping
• G — Energy Release Rate
• HCI = G / G_IC
Panels exceeding 5.25 J/m² are predicted to be at high fracture risk.

Standards Alignment

•WaferForge is a member of the Advanced Photonics Coalition (APC).
HCI directly implements:
• Substrate Integrity Framework
• Metrology Agnostic Volumetric Ingest
• Yield Command Interface

Modeled Impact

Using representative 1.6T CPO assumptions:
• Projected yield uplift: up to 18%
• Projected scrap avoidance: ~$1.32M/month
• Projected edge zone risk reduction: 20–30%
These projections are based on the HCI Engine’s Δσ_thermal breakdown model, RGE amplification, and defect density weighting.

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Annual Licensing Options

Team License: $25k/yr

For R&D groups, universities, and pilot lines.
Includes: HCI Engine (Excel), Library updates, email support.

Engineering License: $75k/yr

For OSATs and substrate suppliers.
Includes: Engine, calibration, training session, support.

Enterprise License: $150k/yr

For IDMs and CPO integrators.
Includes: Full engine, training, integration support, quarterly updates.

Strategic Advisory: $450k/yr

For standards teams, APC members, and roadmap owners.
Includes: Custom modeling, new materials, Δσ_thermal extensions, quarterly reviews.

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Joe Harden Founder, WaferForge LLC

Joe Harden brings over 30 years of semiconductor manufacturing experience from Texas Instruments, where he held leadership roles in yield improvement, process integration, and high-volume production of advanced analog and embedded devices. He is the inventor of the Harden Criticality Index (HCI), a physics-based predictive reliability platform for glass core substrates and advanced packaging. As an Associate Member of the Advanced Photonics Coalition (APC), Joe has actively participated in working groups focused on photonics and advanced packaging technologies. Based in Garland, Texas, he is focused on enabling deterministic yield for next-generation AI/HPC and 1.6T+ optical engine technologies.

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Ready to Evaluate WaferForge?

WaferForge is licensed annually to qualified engineering teams, IDMs, substrate manufacturers, and standards groups.
Contact us to receive pricing, documentation, a walkthrough of the Harden Criticality Index (HCI) Engine, and onboarding details.

Click below to start the conversation.

📘 TERMS OF USE (WaferForge)

Last Updated: April 2026These Terms of Use (“Terms”) govern your access to and use of the WaferForge website, materials, and any information provided through this site (“Site”). By accessing or using the Site, you agree to these Terms.1. Use of the Site
You may use this Site solely for informational purposes and to request licensing information about WaferForge products. You may not:Copy, reproduce, or distribute Site content without permissionAttempt to reverse‑engineer any part of the SiteUse the Site for unlawful or unauthorized purposes2. No Warranties
All information on this Site is provided “as‑is” without warranties of any kind, including accuracy, completeness, or fitness for a particular purpose. WaferForge LLC does not guarantee that the Site will be error‑free or uninterrupted.3. Intellectual Property
All content on this Site — including text, graphics, branding, and documentation — is the property of WaferForge LLC and protected by applicable intellectual property laws. No license or rights are granted except as expressly stated.4. Limitation of Liability
To the fullest extent permitted by law, WaferForge LLC is not liable for any direct, indirect, incidental, or consequential damages arising from your use of the Site or reliance on its content.5. External Links
This Site may link to external documents or resources. WaferForge LLC is not responsible for the content, policies, or practices of third‑party sites.6. Changes to These Terms
We may update these Terms at any time. Continued use of the Site constitutes acceptance of the updated Terms.7. Contact
For questions about these Terms, email: [email protected]

📄 LICENSING AGREEMENT SUMMARY (WaferForge)
(This is a prospect‑facing summary — not the full legal agreement.)

Overview
The WaferForge Licensing Agreement governs access to the Harden Criticality Index (HCI) Engine, Scenario Engine, and associated modeling tools. This summary highlights the key terms provided to prospective clients.1. License Grant
Clients receive a non‑exclusive, non‑transferable, annual license to use the WaferForge HCI Engine and included modules for internal engineering, modeling, and decision‑support purposes.2. Included Components
A standard WaferForge license includes:HCI EngineScenario EngineCapEx Lifecycle Modifier (CLM)Depreciation Toggle BlockResidual Value OverlayDocumentation + onboardingEmail support3. Restrictions
Clients may not:Redistribute, sublicense, or expose the engine to third partiesReverse‑engineer or modify the softwareUse the engine for competitive analysis or benchmarking4. Payment Terms
Annual fee due 100% upfront, Net‑30ACH / wire transfer onlyAccess granted after payment clearsLate payments accrue 1.5% per monthAll fees are non‑refundable5. Confidentiality
Both parties agree to maintain the confidentiality of non‑public information exchanged during evaluation, licensing, or support.6. Intellectual Property
All rights, title, and interest in WaferForge technology, models, algorithms, and outputs remain the exclusive property of WaferForge LLC.7. Warranty & Liability
WaferForge provides the software “as‑is.”
No guarantee is made regarding:Yield improvementScrap reductionFracture‑risk eliminationAccuracy under untested conditionsLiability is limited to the amount paid under the license.8. Term & Renewal
Licenses renew annually unless terminated with 30 days’ written notice before renewal. Renewal invoices are issued 30 days prior to the renewal date.9. Support
Email support is included. Additional advisory or custom modeling services may be contracted separately.10. Contact
For licensing questions or a full agreement, email: [email protected]

📄 PRIVACY POLICY (WaferForge)

Last Updated: April 2026WaferForge LLC (“we”, “us”, “our”) is committed to protecting your privacy. This Privacy Policy explains what information we collect, how we use it, and your rights regarding that information.1. Information We Collect
We collect the following information when you contact us or request licensing information:Name
Email address
Company name
Any information you voluntarily include in your messageWe do not collect analytics, cookies, tracking data, or behavioral information.2. How We Use Your Information
We use the information you provide to:Respond to licensing inquiries
Provide product information
Communicate about onboarding or support
Maintain internal recordsWe do not sell, rent, or share your information with third parties.3. Data Storage
Information you provide is stored securely and accessed only by authorized personnel for business purposes.4. Your Rights
You may request that we:Delete your information
Provide a copy of your information
Correct inaccurate informationTo make a request, contact us at the email below.5. Third‑Party Links
If we link to external documents (e.g., PDFs), those sites may have their own privacy policies. We are not responsible for their content or practices.6. Contact
For privacy questions or requests, email: [email protected]

DISCLAIMER

⚠️ DISCLAIMER (WaferForge)
The WaferForge Harden Criticality Index (HCI) and associated modeling tools provide predictive estimates based on engineering inputs and known material behaviors. All outputs are provided “as‑is” and are intended for informational and engineering decision‑support purposes only.WaferForge LLC makes no guarantees regarding:· Yield improvement
· Scrap reduction
· Fracture‑risk elimination
· Accuracy of predictions under untested conditionsModel outputs are not a substitute for physical validation, reliability testing, or qualification processes. WaferForge LLC is not liable for any direct, indirect, or consequential damages arising from the use of the HCI Engine or its outputs.

📬 CONTACT

WaferForge LLC
Texas, United States
Email: [email protected]
Website: waferforge.comFor licensing inquiries, support, or general questions, please reach out via email.

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